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About Advanced Packaging and Testing Taiwan

 

Focusing on Key Advanced Packaging and Testing Technologies to Build a Next-Generation Semiconductor Supply Chain Platform

 

As AI computing sweeps across the globe, heterogeneous integration and advanced packaging have become the critical drivers of semiconductor innovation. With rapid CoWoS expansion and accelerated adoption of FOPLP and glass substrates (TGV), the advanced packaging equipment market is scaling new heights at a CAGR of over 15%.

Advanced Packaging and Testing Taiwan—Taiwan's sole exhibition dedicated to advanced packaging—is set to debut on April 21–23, 2027, at TaiNEX 1 (4F).

The expo connects the full industrial value chain:

Join global industry pioneers to harness forward-looking momentum, unlock high-value business connections, and stay ahead in the next era of semiconductor packaging.

 

 

Exhibit Profile

 

Panel-Level Advanced Packaging

 

  1. Fan-Out Panel-Level Packaging (FOPLP)
  2. CoWoS / Wafer-Level Packaging (WLP)
  3. 2.5D/3D IC
  4. Chiplet Heterogeneous Integration
  5. Silicon Photonics & Co-Packaged Optics (CPO)

 

TGV & Glass Substrates

 

  1. Through-Glass Via (TGV) Drilling & Metallization/Plating
  2. Laser Etching & Chemical Mechanical Polishing (CMP)
  3. High-Rigidity Low-CTE Glass Core Substrates

 

Semiconductor Packaging & Assembly Equipment

 

  1. High-Precision Die Attach & Bonding Equipment
  2. Molding Presses
  3. CMP Grinding & Thinning Systems
  4. Laser Dicing & Debonding Systems

 

Smart Semiconductor Automation Solutions

 

  1. Automated Material Handling Systems (AMHS)
  2. Cleanroom AMRs & Robotics
  3. Smart Manufacturing MES
  4. AI-Driven Yield Analysis & Defect Classification

 

Advanced Packaging Metrology & Testing

 

  1. 3D Automated Optical Inspection (AOI)
  2. Automated X-ray Inspection (AXI) Tomography
  3. Substrate Warpage Metrology
  4. Probe Cards & System-Level Testing (SLT)

 

Advanced Packaging Materials

 

  1. Epoxy Molding Compounds (EMC)
  2. Photosensitive Polyimide (PSPI) Dielectrics
  3. ABF Substrates
  4. Underfills
  5. Thermal Interface Materials (TIM)

 

Key Modules & Components for Semiconductor Equipment

 

  1. Nanometer Precision Positioning Stages
  2. Ultra-High-Resolution Optical Lenses
  3. Electrostatic Chucks (E-Chucks)
  4. Vacuum Pumps & RF Generators / Power Supplies

 

Semiconductor Cybersecurity

 

  1. SEMI E187/E188 Equipment Compliance
  2. OT Zero Trust Architecture
  3. Fab Anti-Ransomware & Threat Detection Solutions

 

 

Connecting Key Buyers Across the Complete Advanced Packaging Value Chain

 

  1. Semiconductor Manufacturing & Core Packaging / Testing (OSAT)
    • Pure-Play Foundry Services
    • Advanced Packaging & Testing
    • IC Design (Fabless)

  2. Supply Chain Equipment, Materials & Components
    • Front-End & Back-End Semiconductor Equipment
    • Advanced Packaging Materials & Specialty Chemicals
    • High-Precision Modules, Components & Compound Semiconductors

  3. Next-Gen End-Applications & System Integration
    • AI Servers & High-Performance Computing (HPC)
    • Automotive Electronics & New Energy Vehicles (NEVs / EVs)
    • EMS & Large-Scale Systems Integration

 

 

Exhibition Information

 

Show Dates

 

April 21 (Wed.) - April 23 (Fri.), 2027

10:00 AM - 5:00 PM (Closing one hour early on the last day)

* Visitors under 18 are not admitted.

 

Venue

 

Taipei Nangang Exhibition Center,Hall1,4F
Address : No1, Jingmao 2nd Rd., Nangang District, Taipei City, Taiwan Map

 

Organizer

 

 

Co-organizer

 

 

 

Exhibition Fee

 

Type of Booth Price Early-Bird Price Member
Price
Raw Space (9m2) US$2,880 US$2,520 US$2,160
Standard Booth (9m2) US$3,240 US$2,880 US$2,520
Pavilion Booth (9m2) US$3,600 US$3,240 US$2,880

 

  1. Early Bird Price is available before 30/11/2026.
  2. Prices above are tax-included.
  3. Members of TDUA, TPSA, TDMDA, TEEIA, TSOMDA and SID can have the member price.
  4. Standard Booth contains: 3 ×Partitions, 3×Spot lights, 1×110V socket, 1×Carpet (9 sqms),1 × Fascia, 1× Information Desk and chair.
  5. Exhibitors could choose to tent raw space (choose the contractor by self) or standard booth with basic furniture (official contractor)
  6. Power Electricity, 24hrs electricity, water supply of water pipe, air compressor and forklift will be charged additionally.

 

2027 Application Form

 

 

Visitor Admission

 

To visit, please register/login through the "Exhibition Membership System.

 

Procedure

 

 

 

  1. The “Admission QR Code” is only valid for the issued user.
  2. After registration, you may login to [ Member Center ] → [ Admission ] → [ Pre-registration ] page to confirm your status.
  3. Pets are prohibited, except for guide dogs.
  4. All visitors must be in appropriate attire. Those wearing slippers will not be allowed entry.
  5. If visitors have any concerns regarding personal data collected through the membership application, tickets will be sold onsite. Please proceed to the VIP check-in counter for assistance.
  6. Please comply with the Ministry of Foreign Affairs' regulations for the exhibition before applying for the visiting application. The competent authorities reserve the right to modify, insert, and/or withdraw any part of the rules specified herein.

 

 

Marketing Strategy

 

 

 

Booth Allocation and Registration

 

 

  1. During closing of application or when all booths are filled, the preparation office of the organizer will divide the areas uniformly based on product category. During the exhibitors meeting, exhibitors will select the location of their booth based on its product area. (Booth selection shall not be across the aisle).
  2. Booth Allocation Order as follows:
    (1) Number of booths.
    (2) The winner of the e-Touch award.
    (3) The total number of booths within 3 years. (2027+2026+2025)
    (4) Application date.
    (5) If the priority can not be decided among all cases above, it will be based on the result of draw lots onsite.
  3. The organizer has the right to select booth location for exhibitors who is absent during exhibitors meeting.
  4. The organizer has the right to change the layout of the exhibition area, depends on exhibit situation and demand.
  5. To keep the safety of the floor construction, the organizer has the right to assign the location of the displayed product.
  6. Several exhibitors cannot join together to register and select booth.

 

 

Withdrawal from the Exhibition

 

  1. Once the booth fee for the exhibition is paid, it will not be refunded and will be used for payment of promotional expense for this exhibition.
  2. Booth rented by the participating company cannot be transferred in private or utilized by company with name other than the company name during application (including name of sponsoring company). If there is violation, the organizer will immediately take back the transferred booth and will prohibit the company who did not apply to exhibit to continue to exhibit. The transferor will be prohibited to participate in any trade promotion activity conducted in the country by the organizer within two years.
  3. Displayed products must be related to the theme of this exhibition, or it will be prohibited.

 

 

Contact Us

 

Taiwan Electronic Equipment Industry Association (TEEIA)

Ms. Lin ext. 12 / Ms. Hsiao ext. 24／Ms. Cheng ext. 35

Tel: 886-2-2729-3933

Fax: 886-2-2729-3950

Email: show@teeia.org.tw

 

Chan Chao International Co., Ltd.

Mr. Jesse ext. 135 / Mr. Nathan ext. 145

Tel: 886-2-2659-6000

Fax: 886-2-2659-7000

Email: touch@chanchao.com.tw

 

 

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